I. PROJECT BACKGROUND
As 5G network deployment enters the high-frequency band phase, millimeter wave technology (24-300GHz) has become crucial for achieving ultra-high-speed and low-latency communication. However, millimeter wave antenna design faces challenges including significant signal attenuation, high integration difficulty, and precise manufacturing requirements. A leading telecommunications equipment manufacturer urgently requires a highly integrated and low-loss antenna solution when developing next-generation 5G base stations.
II. TECHNICAL PAIN POINTS
1. Space limitation: the equipment needs to accommodate multi-band antennas, and the millimeter wave module must be miniaturized;
2. Signal integrity :high frequency transmission requires high precision of circuit wiring and material conductivity;
3. Mass production consistency :Manual welding is difficult to ensure reliability in mass production.
III. SOLUTIONS
The core innovations of the millimeter wave antenna module shown in the figure are as follows:
1.Integrated design
The antenna array, RF front end and matching circuit are integrated into a single package (AiP) with a size of only 15×15mm;
The gold and gold wiring reduces the transmission loss, and the impedance control accuracy is up to ±0.1Ω.
2. Precision manufacturing process
Through the semi-automatic soldering robot to accurately control the welding temperature (±3℃ error) and solder paste amount (0.1mm³ precision);
The ceramic substrate is combined with low temperature co-fired ceramic (LTCC) technology to improve thermal stability.
3. Test and verification
The beam forming performance was tested in a dark room environment, with an angular scan range ±60° and a gain of 12dBi;
The bit error rate (BER) test shows that the signal transmission stability is better than 10-¹².
IV. APPLICATIONS
1. Performance improvement
The terminal device download rate is increased to 3.2Gbps (40% higher than the traditional solution);
The air port delay is reduced to 0.8ms, which meets the real-time control requirements of industrial automation.
2. Commercialization progress
The solution has been applied to 5G small base stations, CPE terminals and AR/VR devices, with a total shipment of more than 2 million sets;

V. Industry value
This case demonstrates the collaborative innovation value of millimeter wave antenna precision manufacturing and system level packaging (SiP) technology:
It provides a high frequency integrated antenna technology path for 6G terahertz communication;
Promote the domestic radio frequency industry chain to break through the bottleneck of high-end technology and achieve autonomy and control.
